Multiple gate length vertical field-effect-transistors

ABSTRACT

Various embodiments disclose a method for fabricating a semiconductor structure. In one embodiment, the method includes forming a masking layer over at least a first portion of a source contact layer formed on a substrate. At least a second portion of the source contact layer is recessed below the first portion of the source contact layer. The mask layer is removed and a first spacer layer, a replacement gate on the first spacer layer, a second spacer layer on the replacement gate, and an insulating layer on the second spacer layer are formed. First and second trenches are then formed. A first channel layer is epitaxially grown within the first trench. A second channel layer is epitaxially grown within the second trench. A length of the second channel layer is greater than a length of the first channel layer.

BACKGROUND OF THE INVENTION

The present disclosure generally relates to the field of semiconductors,and more particularly relates to vertical field-effect-transistors.

Vertical transistors are a promising option for technology scaling for 5nm and beyond. Multiple gate length devices are important sopower/performance tradeoff can be tuned in circuit design. However,achieving multiple gate lengths for a vertical field-effect-transistoris challenging due to the topography it creates.

SUMMARY OF THE INVENTION

In one embodiment, a method for fabricating a semiconductor structureincluding a plurality of vertical transistors each having gate lengthsis disclosed. The method comprises forming a masking layer over at leasta first portion of a source contact layer formed on a substrate. Atleast a second portion of the source contact layer is recessed below thefirst portion of the source contact layer. The mask layer is removed anda first spacer layer, a replacement gate on the first spacer layer, asecond spacer layer on the replacement gate, and an insulating layer onthe second spacer layer are formed on the first and second portions ofthe source contact layer. A first trench extending from a top surface ofthe insulating layer down to a top surface of the first portion of thesource contact layer is then formed. A second trench extending from thetop surface of the insulating layer down to a top surface of the secondportion of the source contact layer is formed. A first channel layer isepitaxially grown within the first trench from the first portion of thesource contact layer. A second channel layer is epitaxially grown withinthe second trench from the second portion of the source contact layer. Alength of the second channel layer is greater than a length of the firstchannel layer.

In another embodiment, a semiconductor structure is disclosed. Thesemiconductor structure comprises a first vertical field-effecttransistor formed on a substrate. The first vertical field-effecttransistor comprises a first gate length. The semiconductor structurefurther comprises at least a second vertical field-effect transistorformed on the substrate. The second vertical field-effect transistorcomprises a second gate length that is different from the first gatelength of the first vertical field-effect transistor.

In yet another embodiment, an integrated circuit is disclosed. Theintegrated circuit comprises a semiconductor structure. Thesemiconductor structure comprises a first vertical field-effecttransistor formed on a substrate. The first vertical field-effecttransistor comprises a first gate length. The semiconductor structurefurther comprises at least a second vertical field-effect transistorformed on the substrate. The second vertical field-effect transistorcomprises a second gate length that is different from the first gatelength of the first vertical field-effect transistor.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying figures where like reference numerals refer toidentical or functionally similar elements throughout the separateviews, and which together with the detailed description below areincorporated in and form part of the specification, serve to furtherillustrate various embodiments and to explain various principles andadvantages all in accordance with the present disclosure, in which:

FIG. 1 is a cross-sectional view of an initial semiconductor structureaccording to one embodiment of the present disclosure;

FIG. 2 is a cross-sectional view of the semiconductor structure after amasking layer has been formed over a first portion of a source contactlayer according to one embodiment of the present disclosure;

FIG. 3 is a cross-sectional view of the semiconductor structure after asecond portion of source contact layer has been recessed according toone embodiment of the present disclosure;

FIG. 4 is a cross-sectional view of the semiconductor structure afterthe masking layer has been removed and a first spacer layer, replacementgate, second spacer layer, and an insulating layer have been formedtherein according to one embodiment of the present disclosure;

FIG. 5 is a cross-sectional view of the semiconductor structure after afirst trench and a second trench have been formed in a first region anda second region, respectively, of the semiconductor structure accordingto one embodiment of the present disclosure;

FIG. 6 is a cross-sectional view of the semiconductor structure after afirst channel layer and a second channel layer have been epitaxiallygrown within the first and second trenches, respectively, accordingly toone embodiment of the present disclosure;

FIG. 7 is a cross-sectional view of the semiconductor structure afterthe first and second channel layers have been recessed and a mask formedthereon according to one embodiment of the present disclosure;

FIG. 8 is a cross-sectional view of the semiconductor structure after aportion of the first and second channel layers have been narrowedaccording to one embodiment of the present disclosure;

FIG. 9 is a cross-sectional view of the semiconductor structure afterdrain regions have been formed on the narrowed portions of the first andsecond channel layers according to one embodiment of the presentdisclosure;

FIG. 10 is a cross-sectional view of the semiconductor structure afterspacers have been formed on the drain regions, masks, and top spacerlayer of the structure according to one embodiment of the presentdisclosure;

FIG. 11 is a cross-sectional view of the semiconductor structure afterportions of the structure not underlying the spacers have been removeddown to a bottom spacer layer according to one embodiment of the presentdisclosure;

FIG. 12 is a cross-sectional view of the semiconductor structure after areplacement gate has been removed exposing portions of the first andsecond channel layers according to one embodiment of the presentdisclosure;

FIG. 13 is a cross-sectional view of the semiconductor structure after adielectric layer has been formed on the exposed portions of the firstand second channel layers according to one embodiment of the presentdisclosure;

FIG. 14 is a cross-sectional view of the semiconductor structure aftermetal gate layers have been formed conforming to dielectric layersaccording to one embodiment of the present disclosure;

FIG. 15 is a cross-sectional view of the semiconductor structure after ametal gate fill has been deposited over the structure according to oneembodiment of the present disclosure;

FIG. 16 is a cross-sectional view of the semiconductor structure afterthe metal gate fill has been recessed according to one embodiment of thepresent disclosure;

FIG. 17 is a cross-sectional view of the semiconductor structure afterthe recessed metal gate fill has been patterned according to oneembodiment of the present disclosure;

FIG. 18 is a cross-sectional view of the semiconductor structure after adielectric material has been deposited over the structure and contactshave been formed according to one embodiment of the present disclosure;and

FIG. 19 is an operational flow diagram illustrating one process forfabricating a semiconductor structure comprising a plurality of verticaltransistors each having different gate lengths according to oneembodiment of the present disclosure.

DETAILED DESCRIPTION

It is to be understood that the present disclosure will be described interms of a given illustrative architecture; however, otherarchitectures, structures, substrate materials and process features andsteps may be varied within the scope of the present disclosure.

It will also be understood that when an element such as a layer, regionor substrate is referred to as being “on” or “over” another element, itcan be directly on the other element or intervening elements may also bepresent. In contrast, when an element is referred to as being “directlyon” or “directly over” another element, there are no interveningelements present. It will also be understood that when an element isreferred to as being “connected” or “coupled” to another element, it canbe directly connected or coupled to the other element or interveningelements may be present. In contrast, when an element is referred to asbeing “directly connected” or “directly coupled” to another element,there are no intervening elements present.

The present embodiments may include a design for an integrated circuitchip, which may be created in a graphical computer programming language,and stored in a computer storage medium (such as a disk, tape, physicalhard drive, or virtual hard drive such as in a storage access network).If the designer does not fabricate chips or the photolithographic masksused to fabricate chips, the designer may transmit the resulting designby physical means (e.g., by providing a copy of the storage mediumstoring the design) or electronically (e.g., through the Internet) tosuch entities, directly or indirectly. The stored design is thenconverted into the appropriate format (e.g., GDSII) for the fabricationof photolithographic masks, which typically include multiple copies ofthe chip design in question that are to be formed on a wafer. Thephotolithographic masks are utilized to define areas of the wafer(and/or the layers thereon) to be etched or otherwise processed.

Methods as described herein may be used in the fabrication of integratedcircuit chips. The resulting integrated circuit chips can be distributedby the fabricator in raw wafer form (that is, as a single wafer that hasmultiple unpackaged chips), as a bare die, or in a packaged form. In thelatter case the chip is mounted in a single chip package (such as aplastic carrier, with leads that are affixed to a motherboard or otherhigher level carrier) or in a multichip package (such as a ceramiccarrier that has either or both surface interconnections or buriedinterconnections). In any case the chip is then integrated with otherchips, discrete circuit elements, and/or other signal processing devicesas part of either (a) an intermediate product, such as a motherboard, or(b) an end product. The end product can be any product that includesintegrated circuit chips, ranging from toys and other low-endapplications to advanced computer products having a display, a keyboardor other input device, and a central processor.

Reference in the specification to “one embodiment” or “an embodiment” ofthe present principles, as well as other variations thereof, means thata particular feature, structure, characteristic, and so forth describedin connection with the embodiment is included in at least one embodimentof the present principles. Thus, the appearances of the phrase “in oneembodiment” or “in an embodiment”, as well any other variations,appearing in various places throughout the specification are notnecessarily all referring to the same embodiment.

Referring now to the drawings in which like numerals represent the sameof similar elements, FIGS. 1-18 illustrate various processes forfabricating vertical field-effect-transistors (FETs) comprising multiplegate lengths. FIG. 1 shows a partially fabricated semiconductor device100 comprising a substrate 102, a counter-doped layer 104, and a (doped)source contact layer 106. The thickness of the substrate 102 can be, forexample, from 50 microns to 1,000 microns, although lesser and greaterthicknesses can be employed as well. The substrate 102 can be singlecrystalline and or a bulk substrate, a semiconductor-on-insulator (SOI)substrate, or a hybrid substrate. An insulator layer (not shown)comprising a dielectric material such as silicon oxide, silicon nitride,silicon oxynitride, or any combination thereof can be formed on an incontact with the substrate 102.

The substrate 102 can be appropriately doped either with p-type dopantatoms or with n-type dopant atoms, or the material can be substantiallyundoped (intrinsic). The dopant concentration of the substrate 102 canbe from 1.0×10¹⁵/cm³ to 1.0×10¹⁹/cm³, and in one embodiment, is from1.0×10¹⁶ cm³ to 3.0×10¹⁸/cm³, although lesser and greater dopantconcentrations are applicable as well. The counter-doped layer 104 isformed on an in contact with the substrate 102 (or a buried insulatorlayer if formed). The counter-doped layer 104 is formed by an epitaxialgrowth of a semiconductor material. The counter-doped layer can then beimplanted with dopants and annealed using, for example, rapid thermalanneal. Alternatively, the counter-doped layer can be doped in-situduring the epitaxial growth. The purpose of the counter-doped layer isto provide an isolation between one transistor and the next transistor.The source contact layer 106 is formed on and in contact with thecounter-doped layer 104. The source contact 106 can be, for example, ann++ doped region of the substrate 102 and can have a thickness in arange of, for example, about 10 nm to about 200 nm. However, otherthicknesses are applicable as well. The source contact region can beformed by epitaxial growth.

FIG. 2 shows that a masking material is deposited and patterned to forma mask layer 202 over at least a first portion 204 of the source contactlayer 106 in a first region 206 of the structure 100. An etching processsuch as RIE or a wet etch is then performed to recess at least a secondportion 302 of the source contact layer 106 in a second region 304 ofthe structure 100, as shown in FIG. 3. The first portion 206 of thesource contact layer 106 is not recessed since it is protected by themask layer 202 during the etching processes. As a result of the etchingprocess, the first portion 204 of the source contact layer 106 comprisesa height h that is greater than a height h′ of the second portion 302 ofthe source contact layer 106. The height difference between h and h′ canbe, for example, 2 nm to 10 nmm, but is not limited to such dimensions.In one embodiment, the portions of the source contact layer 106 that areunmasked are recessed according to a desired gate length of a device tobe formed on the recessed portion.

After the second portion(s) of the source contact layer 106 has beenrecessed, the masking layer(s) 202 is removed via a selective etchingprocess. A first (bottom) spacer layer 402, a replacement (dummy) gate404, a second (top) spacer layer 406, and an dielectric capping layer408 are then formed on the structure 100, as shown in FIG. 4. The firstspacer 402 is formed on and in contact with the first and secondportions 204, 302 of the source contact layer 106. The first spacerlayer 402 comprises a dielectric material (such as silicon oxide,silicon nitride, silicon oxynitride, or a combination of these) and canbe formed using any conventional deposition process such as, forexample, chemical vapor deposition (CVD).

The replacement gate 404 is formed on and in contact with the firstspacer 402 and comprises a single layer or multiple layers of oxide,polysilicon, amorphous silicon, nitride, or a combination thereof. Thereplacement gate 404 can be formed by CVD processes, thermal oxidation,or wet chemical oxidation. When the replacement gate 404 is initiallyformed, the portion of the replacement gate 404 formed over the secondportion 302 of the source contact layer 106 comprises at least a topsurface that is lower than at least a top surface of the portion of thereplacement gate 404 formed over the first portion 204 of the sourcecontact layer 106. A planarization process is performed to planarize atop portion of the replacement gate 404. For example, FIG. 4 shows theportions of the top surface of the replacement gate 404 within theregions where the channel lengths will be different as being co-planar.This replacement gate stack 404 acts as a place holder for the actualgate stack to be formed after formation of the channel material for thedevice(s).

The second spacer 406 is formed on and in contact with the replacementgate 404. The second spacer 406 comprises a dielectric material (such assilicon oxide, silicon nitride, silicon oxynitride, or a combination ofthese) and can be formed using any conventional deposition process suchas, for example, CVD. The first and second spacer layers 402, 406 cancomprise the same or different materials. The dielectric capping layer408 is formed on and in contact with the second spacer layer 406 andcomprises, for example, silicon dioxide. The dielectric capping layer isa sacrificial layer and comprises a different dielectric material thanthe top spacer dielectric. The purpose of the dielectric capping layer408 is to enable further processing.

FIG. 5 shows that multiple etching processes are performed to form afirst opening/trench 502 within the first region 206 of the structure100 and at least a second opening/trench 504 within the second region304 of the structure 100. For example, masking layers (not shown) can beformed and patterned to define the areas where the trenches 502, 504 areto be formed. Then, a first etching process is performed to remove aportions of the dielectric capping layer 408 selective to the materialof the second spacer layer 406. A second etching process is thenperformed to remove portions of the second spacer layer 406, whichunderlie the portion of the trenches 502, 504 formed from the firstetching process, selective to the material of the replacement gate 404.A third etching process is then performed to remove portions of thereplacement gate 404, which underlie the portion of the trenches 502,504 formed from the second etching process, selective to the material ofthe first spacer layer 402. A fourth etching process is then performedto remove portions of the first spacer layer 402, which underlie theportion of the trenches 502, 504 formed from the third etching process,selective to the material of the source contact layer 106. The resultingtrenches 502, 504 extend through a top surface 506 of the dielectriccapping layer 408 down to a top surface 508, 509 of an exposed portion510, 511 of the source contact layer 106. This creates a self-alignedjunction because a source extension can be epitaxially grown from thesource layer 106 to a top surface of the first spacer layer 402. Thelength/height h of the second trench 504 is greater than a length/heighth′ of the first trench 502 since the portion 302 of the source layer 106underlying the second trench 504 is recessed with respect to the portion204 of the source layer 106 underlying the first trench 502.

FIG. 5 also shows that a protective layer 512, 514 is formed on exposedsidewalls of the replacement gate 404 within each of the first andsecond trenches 502, 504. A plasma oxidation or other type oxidationprocess can be performed to form the protective layers 512, 514. Anepitaxy process is then performed to grow a material 602, 604 within thetrenches 502, 504 forming a first and second channel 606, 608,respectively, as shown in FIG. 6. For example, the epitaxy process growsthe material 602, 604 up from the portions 510, 511 of the sourcecontact layer 106 exposed in the trenches 502, 504 above the top surface506 of the dielectric capping layer 408.

In one embodiment, the epitaxy process grows the materials 602, 604utilizing the same doping concentration. For example, for nFET devices,the channels 606, 608 can comprise, for example, 1e¹⁶-1e¹⁷ cm⁻²phosphorous doped silicon, 1e¹⁷-1e1⁸ cm⁻² phosphorous doped silicon,and/or the like. For pFET devices, the channels 606, 608 can comprise,for example, 1e¹⁷ cm⁻² boron doped SiGe_(0.20), 1e¹⁷ cm⁻² boron dopedSiGe_(0.30), and/or the like. It should be noted that these materials(e.g., Ge, III-V materials, etc.) and doping concentrations are onlyillustrative and other materials and concentrations are applicable aswell. In another embodiment, each of the materials 602, 604 are grownwith different doping concentrations. For example, if the first channel606 was formed utilizing 1e¹⁶-1e¹⁷ cm⁻² phosphorous doped silicon thesecond channel 608 can be formed utilizing 1e¹⁷-1e1⁸ cm⁻² phosphorousdoped silicon. In another example, if the first channel 606 was formedutilizing 1e¹⁷ cm⁻² boron doped SiGe_(0.20) the second channel 608 canbe formed utilizing 1e¹⁷ cm⁻² boron doped SiGe_(0.30). The channelmaterial and doping concentrations can be selected based on the desiredthreshold voltage of the device.

Once the channels 606, 608 have been formed, any overgrowth of channelmaterials 602, 604 are removed by, for example, a chemical-mechanicalpolishing (CMP) process that stops on the dielectric capping layer 408.FIG. 7 shows a portion of the first and second channels 606, 608 beingpartially recessed via an etching process. In this embodiment, thechannels 606, 608 are partially recessed so that a portion 702, 704(e.g., 15-50 nm) of each channel 606, 608 remains above a top surface706 of the second spacer layer 406. A masking material such as nitrideis then deposited and polished back (stopping on the dielectric cappinglayer 408) to form a mask layer 708, 710 on and in contact with a topsurface 712, 714 of the channels 606, 608.

FIG. 8 shows that the dielectric capping layer 408 is removed by, forexample, RIE or CMP, stopping on the second spacer layer 406. A lateraletch is then performed to narrow a portion 802, 804 of the channels 606,608 where drain terminals of the devices are to be formed. The narrowedportions 802, 804 comprise the portions 702, 704 of the channels 606,608 remaining above the second spacer layer 406 and a portion of thechannels 606, 608 extending below the top surface 706 of the secondspacer layer 406 and above a bottom surface 806 of the second spacerlayer 406. In one embodiment, the narrowed portions 802, 804 of thechannels 606, 608 comprise a width of, for example 2 nm to 5 nm whilethe remaining portions 808, 810 of the channels 606, 608 comprise awidth of 4 nm to 10 nm. The lateral etch can be, for example, a wet etchprocess.

FIG. 9 shows that a drain 902, 904 is then formed on the narrowedportions 802, 804 of the channels 606, 608 in each of the first andsecond regions 206, 304 of the structure 100. The drains 902, 904 extendlaterally outward from the narrowed portions 802, 804 of the channels606, 608 beyond the sidewalls of the un-narrowed portions 810, 812 ofthe channels 606, 608 and down to a top surface 914, 916 of theun-narrowed portions 808, 806. Therefore, a bottom portion 906, 908 ofthe drains 902, 904 is below the top surface 706 of the second spacerlayer 406 and above the bottom surface 806 of the second spacer layer406.

The drains 902, 904 can be formed using an epitaxy process. For example,epitaxy that is selective with respect to the materials of the masklayers 708, 710 and the second spacer layer 406 is used grow materialfrom the narrowed portions 802, 804 of the channels 606, 608 to form thedrains 902, 904. The drains 902, 904 comprise in-situ doping (boron, inone embodiment for pFET and phosphorus, in one embodiment, for nFET). Itshould be noted that, according to one embodiment, the drains 902, 904may not contain any doping. In the present embodiment, the doping can beperformed using any standard approach such as ion implantation. Inparticular, the growth rates for (100) vs. (110) oriented planes areengineered so that during the epitaxial growth on (100) Si faceteddrains are obtained. As shown in FIG. 9, the drains 902, 904 compriseangled sides rather than completely abutting the gate. It should benoted that, non-faceted (i.e. vertical) epitaxy and/or multiple epitaxysteps can be used to form the drain structure without limiting the scopeof the present disclosure.

FIG. 10 shows that sacrificial spacers 1002, 1004 comprising adielectric material (such as silicon oxide, silicon nitride, siliconoxynitride, or a combination of these) is formed on and in contact withthe sidewalls of the mask layers 708, 710, the sidewalls of the drains902, 904, and the top surface 706 of the second spacer layer 406. Thesacrificial spacer 1002, 1004 can extend 2 nm to 10 nm past the edge ofthe drain epitaxy on each side. The spacers 1002, 1004 extend laterallybeyond the drains 902, 904 and are planar with a top surface of the masklayers 708, 710. In the illustrated embodiment, the dielectric materialis formed and then reactive-ion etching is used to remove the dielectricmaterial except from the sidewalls of the mask layers 708, 710, thesidewalls of the drains 902, 904, and the top surface 706 of the secondspacer layer 406.

Portions of the second spacer layer 406 and portions of the replacementgate 404 not underlying the sacrificial spacers 1002, 1004 are thenremoved, as shown in FIG. 11. For example, a first etching process suchas RIE is performed to etch portions of the replacement gate 404 notunderlying the sacrificial spacers 1002, 1004 selective to thereplacement gate 404. Then, a second etching process such as RIE is thenperformed to etch portions of the replacement gate 404 not underlyingthe sacrificial spacers 1002, 1004 selective to the first spacer layer402. Portions of the replacement gate 404 underlying the sacrificialspacers 1002, 1004 and the protective layers 402, 704 are then removedexposing the channels 606, 608, as shown in FIG. 12. The portions of thereplacement gate 404 underlying the sacrificial spacers 1002, 1004 andthe protective layers 512, 514 can be removed by selective etching oranother technique.

Once the replacement gate 404 and protective layers 402, 704 have beenremoved, an RMG process is performed. For example, a high-k dielectricmaterial is blanket deposited over the entire structure 100, for exampleby CVD (chemical vapor deposition), PECVD (plasma enhanced chemicalvapor deposition), or ALD (Atomic layer deposition), as shown in FIG.13. The high-k gate material forms a high-k dielectric layer 1302, 1304on, in contact with, and conforming to sidewalls of the spacer layers1002, 1004, a top surface of the mask layers 708, 710, a top surface1305 of the first spacer layer 402, sidewalls of the channels 606, 608,a bottom surface 1310, 1312 of portions 1314, 1316 of the second spacerlayer 406 underlying the sacrificial spacers 1002, 1004, and sidewalls1317, 1319 of the portions 1314, 1316 of the second spacer layer 406. Inone embodiment, the high-k dielectric layer 1302, 1304 is a continuouslayer formed over both structures within the first and second regions206, 304. The high-K gate dielectric layer 1302, 1304 can have athickness between 0.1 nm and 3 nm.

In one embodiment, the portions 1318, 1320 of the high-k gate dielectriclayer 1302, 1304 conforming to the first spacer layer 402 aresubstantially parallel to the portions 1322, 1324 of the high-k gatedielectric layer 1302, 1304 conforming to the 1310, 1312 of portions1314, 1316 of the second spacer layer 406. The portions 1326, 1328 ofthe high-k gate dielectric layers 1302, 1304 conforming to the sidewallsof the channels 606, 608 are substantially perpendicular to portions1318, 1320, 1322, 1324 of the high-k gate dielectric layer, 1302, 1304.The portions 1326, 1328 of the high-k gate dielectric layers 1302, 1304conforming to the sidewalls of the channels 606, 608 are also parallelto portions 1321, 1323 of the high-k gate dielectric layers 1302, 1304conforming to the sidewalls 1317, 1319 of the second spacer layer 406.This configuration of the high-k gate dielectric layer 1302, 1304, inone embodiment, forms a C or rotated U shape.

Examples of high-k materials include but are not limited to metal oxidessuch as hafnium oxide, hafnium silicon oxide, hafnium siliconoxynitride, lanthanum oxide, lanthanum aluminum oxide, zirconium oxide,zirconium silicon oxide, zirconium silicon oxynitride, tantalum oxide,titanium oxide, barium strontium titanium oxide, barium titanium oxide,strontium titanium oxide, yttrium oxide, aluminum oxide, lead scandiumtantalum oxide, and lead zinc niobate. The high-k may further includedopants such as lanthanum, aluminum.

FIG. 14 shows that one or more conductive materials are deposited overthe entire structure 100 to form metal gates 1402, 1404 conforming toand in contact with the high-k gate dielectric layers 1302, 1304. Themetal gates 1402, 1404 comprise a configuration similar to that of thehigh-k gate dielectric layers 1302, 1304 discussed above with respect toFIG. 13. For example, portions of the metal gates 1402, 1404 are formedon and in contact with the portions of the high-k dielectric layer 1302,1304 contacting the sidewalls of the spacer layers 1002, 1004 and thetop surface of the mask layers 708, 710. Portions 1406, 1408 of themetal gates 1402, 1404 conforming to portions 1318, 1320 of the high-kgate dielectric layer 1302, 1304 are substantially parallel to theportions 1410,1412 of the of the metal gates 1402, 1404 conforming toportions 1322, 1324 of the high-k gate dielectric layer 1302, 1304.Portions 1414, 1416 of the metal gates 1402, 1404 conforming to portions1326, 1328 of the high-k gate dielectric layers 1302, 1304 aresubstantially perpendicular to portions 1406, 1408, 1410, 1412 of themetal gates 1402, 1404. Also, portions 1414, 1416 are parallel toportions 1418, 1420 of the metal gates 1402, 1404 conforming to portions1321, 1323 of the high-k gate dielectric layers 1302, 1304.

In one embodiment, the conductive material comprises polycrystalline oramorphous silicon, germanium, silicon germanium, a metal (e.g.,tungsten, titanium, tantalum, ruthenium, zirconium, cobalt, copper,aluminum, lead, platinum, tin, silver, gold), a conducting metalliccompound material (e.g., tantalum nitride, titanium nitride, tungstensilicide, tungsten nitride, ruthenium oxide, cobalt silicide, nickelsilicide), carbon nanotube, conductive carbon, or any suitablecombination of these materials. The conductive material may furthercomprise dopants that are incorporated during or after deposition. Theconductive material may comprises multiple layers such as gateworkfunction setting layer (work function metal) and gate conductivelayer.

FIG. 15 shows that a gate fill material layer 1502 is blanket depositedover the structure 100 shown in FIG. 14. The gate fill material layer1502 can be, for example, tungsten or aluminum. The gate fill materiallayer 1502 is then polished using, for example, CMP. For example, FIG.16 shows that the gate fill material layer 1502 has been polished downto a top surface 706 of the second spacer layer 406. FIG. 16 also showsthat a subsequent polishing or etching process is performed to removeportions of the metal gates 1402, 1404 and corresponding high-kdielectric layer 1302, 1304 that are above the top surface 706 of thesecond spacer layer 406.

Lithography and etching processes are used to pattern the recessed gatefill material layer 1502. For example, FIG. 17 shows that areas of therecessed portions of the recessed gate fill material layer 1502 havebeen removed exposing portions 1702, 1704, 1706 of the bottom spacerlayer 402 on each side of the devices in the first and second regions206, 304. FIG. 17 also shows that an inter-layer dielectric material1708 has been formed over the entire structure 100. The fabricationprocess is then continued to form contacts for the devices in the firstand second regions 206, 304. For example, FIG. 18 shows that lithographyand etching processes are performed to create contact trenches withinthe dielectric material 1708 and down into (below a top surface) therecessed gate fill material layer 1502 on at least one side of thedevices within the first and second regions 206, 304. This lithographyand etching processes also form a trench within the hardmasks 708, 710between the spacers 1002, 1004 to create contact trenches exposing atleast a top surface of the drains 902, 904 and the narrowed portions802, 804 of the channels 606, 608. A metallization process is thenperformed to create contacts 1802, 1804, 1806, 1808 in the contacttrenches. The metallization can involve CVD, PVD, ALD, or electroplatingprocesses or some combination of these processes.

FIG. 19 is an operational flow diagram illustrating one process forfabricating a semiconductor structure comprising a plurality of verticaltransistors each having different gate lengths according to oneembodiment of the present disclosure. In FIG. 19, the operational flowdiagram begins at step 1902 and flows directly to step 1904. It shouldbe noted that each of the steps shown in FIG. 19 has been discussed ingreater detail above with respect to FIGS. 1-18. A masking layer, atstep 1904, is formed over at least a first portion of a source contactlayer formed on a substrate. At least a second portion of the sourcecontact layer, at step 1206, is recessed below the first portion of thesource contact layer.

The mask layer is removed and a first spacer layer on the first andsecond portions of the source contact layer, a replacement gate on thefirst spacer layer, a second spacer layer on the replacement gate, andan insulating layer on the second spacer layer, are formed on the firstand second portions of the source contact layer, at step 1908. A firsttrench, at step 1910, is formed that extends from a top surface of theinsulating layer down to a top surface of the first portion of thesource contact layer. A second trench, at step 1912, is formed thatextends from a top surface of the insulating layer down to a top surfaceof the second portion of the source contact layer. A first channellayer, at step 1914, is epitaxially grown within the first trench fromthe first portion of the source contact layer. A second channel layer,at step 1916, is epitaxially grown within the second trench from thesecond portion of the source contact layer, where a length of the secondchannel layer is greater than a length of the first channel layer.Additional fabrication processes such as metal gate and contactformation can then be performed. The control flow exits at step 1918.

Although specific embodiments of the disclosure have been disclosed,those having ordinary skill in the art will understand that changes canbe made to the specific embodiments without departing from the spiritand scope of the disclosure. The scope of the disclosure is not to berestricted, therefore, to the specific embodiments, and it is intendedthat the appended claims cover any and all such applications,modifications, and embodiments within the scope of the presentdisclosure.

It should be noted that some features of the present disclosure may beused in one embodiment thereof without use of other features of thepresent disclosure. As such, the foregoing description should beconsidered as merely illustrative of the principles, teachings,examples, and exemplary embodiments of the present disclosure, and not alimitation thereof.

Also these embodiments are only examples of the many advantageous usesof the innovative teachings herein. In general, statements made in thespecification of the present application do not necessarily limit any ofthe various claimed disclosures. Moreover, some statements may apply tosome inventive features but not to others.

What is claimed is:
 1. A method for fabricating a semiconductorstructure comprising a plurality of vertical transistors each havingdifferent gate lengths, the method comprising: form a masking layer overat least a first portion of a source contact layer formed on asubstrate; recessing at least a second portion of the source contactlayer below the first portion of the source contact layer; removing themasking layer and forming a first spacer layer on the first and secondportions of the source contact layer, a replacement gate on the firstspacer layer, a second spacer layer on the replacement gate, and aninsulating layer on the second spacer layer; forming a first trenchextending from a top surface of the insulating layer down to a topsurface of the first portion of the source contact layer; forming asecond trench extending from the top surface of the insulating layerdown to a top surface of the second portion of the source contact layer;epitaxially growing a first channel layer within the first trench fromthe first portion of the source contact layer; and epitaxially growing asecond channel layer within the second trench from the second portion ofthe source contact layer, wherein a length of the second channel layeris greater than a length of the first channel layer.
 2. The method ofclaim 1, further comprising: forming a counter-doped layer between thesubstrate and the source contact layer.
 3. The method of claim 1,further comprising: prior to epitaxially growing the first channellayer, forming a protective layer on exposed portions of the replacementgate within the first trench; and prior to epitaxially growing thesecond channel layer, forming a protective layer on exposed portions ofthe replacement gate within the second trench.
 4. The method of claim 1,further comprising: recessing the first and second channel layers, therecessing leaving a first portion of the first and second channel layersabove the second spacer layer; after the recessing, forming a first maskabove and in contact with the first channel layer and forming a secondmask above and in contact with second channel layer; after forming thefirst and second masks, removing the insulating layer exposing the firstportion of the first and second channel layers; and performing a lateraletch of the first portion of the first and second channel layers, thelateral etch narrowing the first portion of the first and second channellayers and a second portion of the first and second channel layers belowa top surface of the second spacer layer.
 5. The method of claim 4,further comprising: forming a first drain region and second drain regionon the first and second portions of the first and second channel layers,respectively.
 6. The method of claim 5, further comprising: forming athird spacer layer on and in contact with sidewalls of the first maskand sidewalls of the first drain region, the third spacer layer alsobeing formed on and in contact with a top surface of the second spacerlayer in a first region corresponding to the first portion of thestructure; and forming a fourth spacer layer on sidewalls of the secondmask and sidewalls of the second drain region, the fourth spacer layeralso being formed on and in contact with a top surface of the secondspacer layer in a second region corresponding to the second portion ofthe structure.
 7. The method of claim 6, further comprising: removingportions of the structure not underlying the third and fourth spacerlayers down to the first spacer layer.
 8. The method of claim 7, furthercomprising: removing a portion of the replacement gate under the thirdspacer layer and a portion of the replacement gate under the fourthspacer layer, the removing exposing sidewalls of the first channel layerand the second channel layer.
 9. The method of claim 8, furthercomprising: forming a first metal gate structure on and in contact withthe exposed sidewalls of the first channel layer, a portion of the firstspacer layer under the third spacer layer, and a portion of the secondspacer layer under the third spacer layer; and forming a second metalgate structure on and in contact with the exposed sidewalls of thesecond channel layer, a portion of the first spacer layer under thefourth spacer layer, and a portion of the second spacer layer under thefourth spacer layer.
 10. The method of claim 9, wherein forming each ofthe first and second metal gate structure comprises: forming a firstdielectric layer on and in contact with the exposed sidewalls of thefirst channel layer, the portion of the first spacer layer under thethird spacer layer, and the portion of the second spacer layer under thethird spacer layer; and forming a second dielectric layer on and incontact with the exposed sidewalls of the second channel layer, theportion of the first spacer layer under the fourth spacer layer, and theportion of the second spacer layer under the fourth spacer layer. 11.The method of claim 10, wherein forming each of the first and secondmetal gate structure further comprises: forming a first metal layer incontact with and conforming to the first dielectric layer; and forming asecond metal layer in contact with and conforming to the seconddielectric layer.
 12. The method of claim 9, further comprising: formingrecessed metal gate fill layers on each side of the first and secondmetal gate structures; depositing a dielectric layer over the first andsecond regions of the structure; forming a first contact trench throughthe dielectric layer exposing at least a top surface of the recessedmetal gate fill layer on at least a first side of the first metal gatestructure; forming a second contact trench through the dielectric layerexposing at least a top surface of the recessed metal gate fill layer onat least a first side of the second metal gate structure; forming athird contact trench exposing a top surface of the first drain regionand a top surface of the first portion of the first channel layer;forming a fourth contact trench exposing a top surface of the seconddrain region and a top surface of the first portion of the secondchannel layer; and forming a contact in each of the first, second,third, and fourth contact trenches.